CENS-D130 introduces a new category of rack-scale precision spray cooling for high-density AI data centers. Planned for commercial release in December 2026, it addresses the power, water, structural, and deployment challenges facing next-generation AI infrastructure. Protected by six patents, including a proprietary AI-assisted TDP tracking algorithm, the platform distributes non-conductive dielectric coolant uniformly across the server-rack chamber while delivering targeted cooling to high-heat components. This hybrid spray architecture maintains thermal coverage while concentrating cooling capacity where demand is greatest. Developed by a team combining grid-scale HVDC thermal engineering with semiconductor inkjet precision technology, CENS-D130 reduces dielectric fluid usage by 95% and floor loading by 70% compared with full-immersion systems. It eliminates process-water consumption during cooling (Zero WUE), achieves a PUE of 1.1, and supports high-temperature waste-heat recovery, enabling rapid retrofit of existing urban data centers while providing a sustainable foundation for future AI infrastructure.