Powered by the Consumer Technology Association (CTA)®

Skip to content
2027 Honoree Award

DX-M2: Big AI, inside the machine

DEEPX
  • 2027 Honoree in Artificial Intelligence
DX-M2 brings large generative AI out of the data center and into robots, vehicles, AI PCs, and other intelligent machines. Today, models above 10 billion parameters usually need GPU-class computing or cloud infrastructure, which adds power, heat, latency, connectivity, and recurring cost. DX-M2 is designed to change that. Built on a 2 nm process, its 5W-class accelerator is designed for 80 TOPS and supports up to 96 GB of 8-channel LPDDR5X memory within an approximately 10W module envelope. That combination is designed to let 10B+ language and multimodal models run locally. Hardware-native mixed precision and the DXNN software stack further reduce model size and data movement. The result is simple: more capable AI can live inside the machine that needs it, instead of somewhere in the cloud.

Learn More About Artificial Intelligence at CES

Transforming industries. Opening up new capabilities. Enhancing efficiencies. Artificial intelligence is already enhancing our lives in profound ways — and the possibilities for the future are seemingly limitless.

See More Innovation Awards

  • 2027 Honoree Award

    JATCO

    Lifmy – Empowering Human Mobility

  • 2027 Honoree Award

    thekeeper

    AX-Guard: Dual-Sensor EV Fire Detection & Underbody Cooling System

  • 2027 Honoree Award

    D.DDECK Co., Ltd.

    Cold Station: Physical AI Cooking with Sealed Inline Ingredient Automation

  • 2027 Honoree Award

    United MINDS HealthTech Limited

    PAIrWatch: Tonoarteriography for Hypertension Management