MLG is a multi-layer glass interposer designed to address a growing bottleneck in AI computing: connecting processors, high-bandwidth memory, chiplets, and supporting components within a limited package footprint. Instead of concentrating routing on the outer surfaces of a glass interposer, MLG distributes electrical paths through independently routed glass layers. Horizontal copper conductors are embedded inside glass trenches, while pre-formed solid copper Wire Core conductors create selected vertical connections without full-via electroplating. MLG integrates five glass circuit layers and seven independent metal wiring layers. Within a 0.845 mm bare stack, MLG provides 50/50 μm line/space; outer layers use 0.3 mm TGVs at a 0.7 mm pitch, and internal layers use 0.1 mm TGVs at a 0.35 mm pitch. An integrated 0603 multilayer ceramic capacitor adds component integration within the same structure. MLG gives AI hardware developers a manufacturable three-dimensional interconnect for increasingly dense processor-to-memory packaging.